2.5D Embedded Wafer Level Processing for Optoelectronic Integration
- Degree Grantor:
- University of California, Santa Barbara. Electrical & Computer Engineering
- Place of Publication:
- [Santa Barbara, Calif.]
- Publisher:
- University of California, Santa Barbara
- Creation Date:
- 2017
- Issued Date:
- 2017
- Keywords:
- Interface toughness,
Adhesive bonding,
Optoelectronic integration,
Thermal residual stress,
Through wafer etch, and
Embedded Wafer Level Processing - Format:
- Text
- Collection(s):
- UCSB electronic theses and dissertations
- ARK:
- ark:/48907/f3rx9c8g
- Catalog System Number:
- 990047729580203776
- Copyright:
- Avantika Sodhi, 2017
- Rights:
In Copyright- Copyright Holder:
- Avantika Sodhi
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